Join an expert panel and industry colleagues in examining innovative new ways to improve the durability of new and existing building envelopes on Thursday, May 8, 2014 from 8:00am to 5:00pm at the Toronto Don Valley Hotel & Suites.
An early-bird registration fee of $350 (plus tax) is available until April 18, 2014; after this date, it is $395 plus tax. save $45. There is limited seating so secure your space now by registering at www.microspec.com/reg/best2014/.
For professionals collecting OAA ConEd Hours, your full-day attendance at the Building Envelope Forum will qualify for 6 (six) OAA ConEd Structured Learning Hours.
For more information, please visit www.buildingenvelopeforum.com or contact Margaret Loong at [email protected].