March 30, 2014
by Canadian Architect
Join an expert panel and industry colleagues in examining innovative new ways to improve the durability of new and existing building envelopes on Thursday, May 8, 2014 from 8:00am to 5:00pm at the Toronto Don Valley Hotel & Suites.
An early-bird registration fee of $350 (plus tax) is available until April 18, 2014; after this date, it is $395 plus tax. save $45. There is limited seating so secure your space now by registering at www.microspec.com/reg/best2014/.
For professionals collecting OAA ConEd Hours, your full-day attendance at the Building Envelope Forum will qualify for 6 (six) OAA ConEd Structured Learning Hours.
For more information, please visit www.buildingenvelopeforum.com or contact Margaret Loong at email@example.com.
building envelope forum